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Goldmont Technology

Mar 14, 2019

Ib tug 14 nm manufacturing txheej txheem

SoC (System on Chip) architecture

3D tri-gate transistors

Cov khoom siv chips mus txog quad-cores

Txhawb kev qhia SSE4.2

Txhawb Intel cov kev qhia AESNI thiab PCLMUL

Txhawb Intel RDRAND thiab RDSEED cov lus qhia

Txhawb kev ua haujlwm hauv SHA Intel

Txhawb Intel MPX (Kev Pab Txhawb Txhawb Txhawb Txhawb)

Gen 9 Intel HD Graphics nrog DirectX 12, OpenGL 4.5 nrog qhov tseeb qhov rais 10 tsav tsheb tshiab [6] (OpenGL 4.5 rau Linux [7]), OpenGL ES 3.2 thiab OpenCL 2.0 yug.

HEVC Main10 & VP9 Profile0 kev pab txhawb kev kho vajtse

10 W ntsuas hluav taws xob tsim hluav taws xob (TDP) Desktop los yog tus neeg ua hauj lwm processors

4.0 rau 6.0 W processors TDP

eMMC 5.0 tshuab txuas rau NAND flash cia

USB 3.1 & USB-C specification

Kev them nyiaj yug rau DDR3L, LPDDR3, thiab LPDDR4 nco

Integrated Sensor Hub (ISH) uas muaj peev xwm coj mus kuaj thiab muab cov ntaub ntawv los ntawm tus neeg sensors thiab ua haujlwm ntawm nws tus kheej thaum lub party host yog nyob rau hauv lub zog qis zog

Image Signal Processor (ISP) txhawb nqa plaub lub koob yees duab concurrent koob yees duab

Lub suab maub los txhawb HD Audio thiab LPE suab

Trusted tiav cav 3.0 ruaj ntseg subsystem